5.0 mm dia led lamp package dimensions drawing no. : ds-35-03-0393 date : 2003-06-26 page : 1 hd-r/rd013 note: 1.all dimensions are in millimeters. 2.tolerance is 0.25mm(0.010 ") unless otherwise specified. 3.protruded resin under flange is 1.5mm(0.059 ") max. 4.lead spacing is measured where the leads emerge from the package. 5.specification are subject to change without notice 560JY8C rev:a / 0
5.0 mm dia led lamp 560JY8C rev:a / 0 features * 5.0mm dia led lamp * high luminous intensity output. * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible. chip materials * dice material : algainp/gaas * light color : ultra yellow * lens color : water clear absolute maximum rating : ( ta = 25 c ) symbol parameter ultra yellow unit p ad power dissipation per chip 80 mw v r reverse voltage per chip 5 v i af continuous forward current per chip 30 ma i pf peak forward current per chip (duty 0.1,1khz) 80 ma derating linear from 25 c per chip 0.40 ma/ c topr operating temperature range -25 c to 85 c tstg storage temperature range -40 c to 85 c lead soldering temperature 1.6mm(0.063 inch) from body 260c 5c for 5 seconds electro-optical characteristics : ( ta = 25 c ) symbol parameter test condi tion min. typ. max. unit v f forward voltage i f = 20ma 1.8 2.1 2.6 v i r reverse current v r = 5v 100 a d dominant wavelength i f = 20ma 585 5 88 590 nm ? spectral line half-width i f = 20ma 15 nm 2 1/2 half intensity angle if = 20ma 50 55 60 deg i v luminous intensity i f = 20ma 1500 1900 2400 mcd drawing no. : ds-35-03-0393 date : 2003-06-26 page : 2 hd-r/rd014
5.0 mm dia led lamp 560JY8C rev:a / 0 drawing no. : ds-35-03-0393 date : 2003-06-26 page : 3
5.0 mm dia led lamp 560JY8C re v:a / 0 y soldering method soldering conditions remark dip soldering bath temperature: 2605 immersion time: with 5 sec y solder no closer than 3mm from the base of the package y using soldering flux,? resin flux? is recommended. soldering iron soldering iron: 30w or smaller t emperature at tip of iron: 260 or lowe r soldering time: within 5 sec. y during soldering, take care not to press the tip of iron against the lead. (to prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) when soldering the lead of led in a condition that the pack age is fixed with a panel (see fig.1), be careful not to stress the leads with iron tip. 2) when soldering wire to the lead, work with a fig (see fig.2) to avoid stressing the package. drawing no. : ds-35-04-0744 date : 2004-12-03 page : 4 p a n e l (fig.1) l e a d w r i e s l e a v e a s l i g h t c l e a r a n c e l e a d w r i e s (fig.2)
5.0 mm dia led lamp 560JY8C re v:a / 0 3) similarly, when a jig is used to solder the led to pc board, take care as much as possible to avoid steering the leads (see fig.3). 4) repositioning after soldering should be avoided as much as possible. if inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the led. 5) lead cutting after soldering should be performed only after the led temperature has returned to normal temperature. y led mounting method 1) when mounting the led by using a case, as shown fig.4, ensure that the mounting holds on the pc board match the pitch of the leads correct ly-tolerance of dimensions of the respective components including the led should be taken into account especially when designing the case, pc board, etc. to prevent pitch misa lignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. alternatively, the shape of the holes should be made oval. (see fig.4) drawing no. : ds-35-04-0744 date : 2004-12-03 page : 5 p c b o a r d ig.3 f jig fig.4 case pc board
5.0 mm dia led lamp 560JY8C r ev:a / 0 2) use leds with stand-off (fig.5) or the tube or spacer made of re sin (fig.6) to position the leds. y formed lead 1) the lead should be bent at a point located at least 2mm away from the package. bending should be performed with base fixed means of a jig or pliers (fig.7) 2) forming lead should be carried our prior to so ldering and never during or after soldering. 3) form the lead to ensure alignment between the leads and the hole on board, so that stress against the led is prevented. (fig.8) drawing no. : ds-35-04-0744 date : 2004-12-03 page : 6 stand-off fig.5 fig.6 tube 2 m m f i g . 7
5.0 mm dia led lamp 560JY8C r ev:a / 0 y lead strength 1) bend strength do not bend the lead more than twice. (fig.9) 2) tensile strength (@ room temperature) if the force is 1kg or less, there will be no problem. (fig.10) y handling precautions although rigid against vibration, the leds may damaged or scratched if dropped. so take care when handling. y chemical resistance 1) avoid exposure to chemicals as it may at tack the led surface and cause discoloration. 2) when washing is required, refer to the follo wing table for the proper chemical to be sued. (immersion time: within 3 minutes at room temperature.) solvent adaptability freon te chlorothene w isopropyl alcohol thinner w acetone w trichloroethylene w --usable w --do not use. drawing no. : ds-35-04-0744 date : 2004-12-03 page : 7 fi g .9 ok fig.10 1kg note: influences of ultras onic cleaning of the led resin body differ depending on such factors as the oscillator output, size of the pc board and the way in which the led is mounted. therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical.
5.0 mm dia led lamp 560JY8C ss re v:a / 0 experiment item: test condition item lamp & ir reference standard operation life ta 25 5 if= 20ma rh =60%rh dynamic:100ma 1ms 1/10 duty static state: if 20ma test time: 168hrs -24hrs +24hrs 500hrs -24hrs +24hrs 1000hrs -24hrs +72hrs mil-std-750 1026 mil-std-883 1005 jis c 7021 b-1 high temperature high humidity storage ta 65 5 rh 90 ? 95%rh test time 240hrs 2hrs mil-std-202 103b jis c 7021 b-1 temperature cycling 105 ? 25 ? -55 ? 25 30min 5min 30min 5min 10cycles mil-std-202 107d mil-std-750 1051 mil-std-883 1010 jis c 7021 a-4 thermal shock 105 5 ? -55 5 10min 10min 10cycles mil-std-202 107d mil-std-750 1051 mil-syd-883 1011 solder resistance t sol 260 5 dwell time 10 lsec mil-std-202 210a mil-std-750-2031 jis c 7021 a-1 solderability t sol 230 5 dwell time 5 lsec mil-std-202 208d mil-std-750 2026 mil-std-883 2003 jis c 7021 a-2 drawing no. : ds-35-04-0744 date : 2004-12-03 page : 8
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